<H1>NXP Library</H1> <author>marco.kuystermans@nxp.com</author><p> <H2>Disclaimer:</H2> <i>The information contained in this library is made available for general information and public access only. By using our library, you accept this disclaimer in full. If you disagree with any part of this disclaimer, you must not use our library. Use of this library is permitted on the basis that NXP will not be liable for any loss or damage including without limitation, indirect or consequential loss or damage, arising out of or in connection with the use of this library.</i> <H2>Information:</H2> <ul><li>Footprints are according to NXP footprint information, see <a href=http://www.nxp.com>NXP website</a> <li>SMD Footprints in this library are for reflow soldering only. <li><b>Library is generated as a courtesy: Information is NOT guaranteed, use at your own risk</b> <li>NXP package numbers (SOT/SOD) numbers used </ul> Please send your comments to the mail address above. <li><b>SOT314-2</b> <hr> <ul><li>LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm <li><u>JEDEC</u>: MS-026 <li><u>IEC</u>: 136E10</ul> >VALUE >NAME <li><b>SOT1175-1</b><hr> <ul><li>SO7: plastic small outline package; 7 leads; body width 3.9 m <li><u>JEDEC</u>: --- <li><u>IEC</u>: ---</ul> >VALUE >NAME SOT1175-1 <li><b>SOT361-1</b><hr> <ul><li>TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm <li><u>JEDEC</u>: MO-153 <li><u>IEC</u>: ---</ul> >VALUE >NAME <li><b>SOT136-1</b><hr> <ul><li>SO28: plastic small outline package; 28 leads; body width 7.5 mm <li><u>JEDEC</u>: MS-013 <li><u>IEC</u>: 075E06</ul> <H3>Please do not use, will be removed</H3> >NAME >VALUE <li><b>SOT78</b> <li>JEDEC TO-220AB <li>JEITA SC-46 >NAME >VALUE <li><b>SOT223</b><hr> <ul><li>Plastic surface-mounted package with increased heatsink; 4 lead <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: SC-73</ul> >VALUE >NAME FIDUCAL <li><b>SOD80C</b><hr> <ul><li>Hermetically sealed glass surface-mounted package; 2 connectors <li><u>JEDEC</u>: -- <li><u>IEC</u>: 100H01 <li><u>JEITA</u>: --</ul> >NAME >VALUE <li><b>SOT457</b><hr> <ul><li>TSOP6: Plastic surface-mounted package; 6 lead <li><u>JEIDA</u>: SC73 <p>A.K.A. SOT23-6 >VALUE >NAME <li><b>SOT313-2</b><hr> <ul><li>LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm <li><u>JEDEC</u>: MS-026 <li><u>IEC</u>: 136E05</ul> Footprint according to NXP SOT313-2 specification, however the cornerpins are 0.4mm in stead of 0.5mm. Probably an error in the specification. >VALUE >NAME <li><b>SOT617-1</b><hr> <ul><li>HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: ---</ul> >VALUE >NAME <li><b>SOD128</b><hr> <ul><li>Plastic surface-mounted package; 2 leads<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE <li><b>SOTxxx</b><hr> <ul><li>HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 x 7 x 0.85 mm <li><u>JEDEC</u>: --- <li><u>IEC</u>: ---</ul> <li>Package according LPC111x datasheet >NAME >VALUE <li><b>SOT315-1</b><hr> <ul><li>LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm <li><u>JEDEC</u>: MS-026 <li><u>IEC</u>: 136E15</ul> >VALUE >NAME <li><b>SOT407-1</b><hr> <ul><li>LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm <li><u>JEDEC</u>: MS-026 <li><u>IEC</u>: 136E20</ul> >VALUE >NAME <b>HVQFN33 </b><p>Plastic thermal enhanced very thin quad flat package; 33 terminals; body 7x7x0.85 mm; <p> Original Library package >NAME >VALUE <li><b>SOT926-1</b><hr> <ul><li>TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: --</ul> >VALUE >NAME SOT926-1 <li><b>SOT505-1</b><hr> <ul><li>TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT96-1</b><hr> <ul><li>SO8: plastic small outline package; 8 leads; body width 3.9 mm <li><u>JEDEC</u>: MS-012 <li><u>IEC</u>: 076E03</ul> >NAME >VALUE <li><b>SOT403-1</b><hr> <ul><li>TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm <li><u>JEDEC</u>: MO-153 <li><u>IEC</u>: ---</ul> >VALUE >NAME <li><b>SOT109-1</b><hr> <ul><li>SO16: plastic small outline package; 16 leads; body width 3.9 mm <li><u>JEDEC</u>: MS-012 <li><u>IEC</u>: 076E07</ul> >NAME >VALUE <b>Dual In Line Package</b> >NAME >VALUE <li><b>SOT363</b><hr> <ul><li>Plastic surface-mounted package; 6 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: SC-88</ul> >VALUE >NAME <li><b>SOT886</b><hr> <ul><li>XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm <li><u>JEDEC</u>: MO-252 <li><u>IEC</u>: ---</ul> >VALUE >NAME SOT886 <li><b>SOT891</b><hr> <ul><li>XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: ---</ul> >VALUE >NAME SOT891 <li><b>SOT1202</b><hr> <ul><li>XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1.0 x 0.35 mm <li><u>JEDEC</u>: --- <li><u>IEC</u>: ---</ul> >VALUE >NAME SOT1202 <li><b>SOT353</b><hr> <ul><li>Plastic surface-mounted package; 5 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA: SC-88A</ul> >VALUE >NAME <li><b>SOD523</b><hr> <ul><li>Plastic surface-mounted package; 2 leads<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: SC-79</ul> >NAME >VALUE <li><b>SOT543-1</b><hr> <ul><li>TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm <li><u>JEDEC</u>: MO195 <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT669</b><hr> <ul><li>Plastic single-ended surface-mounted package (LFPAK; Power-SO8); 4 lead <li><u>JEDEC</u>: MO-235 <li><u>IEC</u>: ---</ul> >VALUE >NAME <li><b>SOT918-1</b><hr> <ul><li>TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 5 x 5 x 0.8 mm <li><u>JEDEC</u>: MO-195 <li><u>IEC</u>: --</ul> >VALUE >NAME SOT918-1 <li><b>SOT137-1</b><hr> <ul><li>SO24: plastic small outline package; 28 leads; body width 7.5 mm <li><u>JEDEC</u>: MS-013 <li><u>IEC</u>: 075E05</ul> <H3>Please do not use, will be removed</H3> >VALUE >NAME <li><b>SOT1039-1</b><hr> <ul><li>HXQFN16U: plastic thermal enhanced extremely thin quad flat package; no leads;16 terminals; UTLP based; body 3 x 3 x 0.5 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: --</ul> >VALUE >NAME SOT1039-1 <li><b>SOT1161-1</b><hr> <ul><li>XQFN16: plastic, extremely thin quad flat package; no leads;16 terminals; body 1.80 x 2.60 x 0.50 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: --</ul> >VALUE >NAME SOT1161-1 <li><b>SOT764</b><hr> <ul><li>DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm <li><u>JEDEC</u>: MO-241 <li><u>IEC</u>: ---</ul> >VALUE >NAME <li><b>SOT486-1</b><hr> <ul><li>LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm <li><u>JEDEC</u>: MS-026 <li><u>IEC</u>: 136E23</ul> >VALUE >NAME <li><b>SOT108-1</b><hr> <ul><li>SO14: plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm <li><u>JEDEC</u>: MS-012 <li><u>IEC</u>: --</ul> >NAME >VALUE <li><b>SOT162-1</b><hr> <ul><li>SO16: plastic small outline package; 16 leads; body width 7.5 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT163-1</b><hr> <ul><li>SO20: plastic small outline package; 20 leads; body width 7.5 mm <li><u>JEDEC</u>: MS-013 <li><u>IEC</u>: 075E04</ul> >VALUE >NAME <li><b>SOT136-1</b><hr> <ul><li>SO28: plastic small outline package; 28 leads; body width 7.5 mm <li><u>JEDEC</u>: MS-013 <li><u>IEC</u>: 075E06</ul> >VALUE >NAME <li><b>SOT176-1</b><hr> <ul><li>SO8: plastic small outline package; 8 leads; body width 7.5 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT109-2</b><hr> <ul><li>SO16: plastic small outline package; 16 leads; body width 3.9 mm <li><u>JEDEC</u>: MS-012 <li><u>IEC</u>: 076E07</ul> >NAME >VALUE <li><b>SOT109-3</b><hr> <ul><li>SO16: plastic small outline package; 16 leads; body width 3.9 mm <li><u>JEDEC</u>: MS-012 <li><u>IEC</u>: 076E07</ul> >NAME >VALUE <li><b>SOT137-1</b><hr> <ul><li>SO24: plastic small outline package; 24 leads; body width 7.5 mm <li><u>JEDEC</u>: MS-013 <li><u>IEC</u>: 075E05</ul> >VALUE >NAME <li><b>SOT287-1</b><hr> <ul><li>SO32: plastic small outline package; 32 leads; body width 7.5 mm <li><u>JEDEC</u>: MO-119 <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT449</b><hr> <ul><li>SOJ40: plastic small outline package; 40 leads (J-bent); body width 10.16 mm <li><u>JEDEC</u>: MS-027 <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT865-3</b><hr> <ul><li>HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT865-3 <li><b>SOT618-1</b><hr> <ul><li>HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT1049</b><hr> <ul><li>XQFN10U: plastic extremely thin quad flat package; no leads; 10 terminals; UTLP based; body 2 x 1.55 x 0.5 mm <li><u>JEDEC</u>: MO-255 <li><u>IEC</u>: --</ul> >VALUE >NAME SOT1049 <li><b>SOT909</b><hr> <ul><li>HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 4 x 4 x 0.85 mm<li><u>JEDEC</u>: -- <li><u>IEC</u>: MO-229 <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT909 <li><b>SOT402-1</b><hr> <ul><li>TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm <li><u>JEDEC</u>: MO-153 <li><u>IEC</u>: ---</ul> >VALUE >NAME <li><b>SOT616</b><hr> <ul><li>HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT617-3</b><hr> <ul><li>HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: -- </ul> >VALUE >NAME <li><b>SOT619-1</b><hr> <ul><li>HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT157</b><hr> <ul><li>DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> 1 >VALUE >NAME <li><b>SOT523</b><hr> <ul><li>DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> 1 >VALUE >NAME <li><b>SOT141</b><hr> <ul><li>PDBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> 1 >VALUE >NAME <li><b>SOT243</b><hr> <ul><li>DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> 1 >VALUE >NAME <li><b>SOT411</b><hr> <ul><li>DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm) <li><u>JEDEC</u>: -- <li><u>IEC</u>: --</ul> 1 >VALUE >NAME <b>Dual In Line Package</b> >NAME >VALUE <b>Dual In Line Package</b> >NAME >VALUE <li><b>SOT146</b><hr> <ul><li>DIP20: plastic dual in-line package; 20 leads (300 mil) <li><u>JEDEC</u>: MS-001 <li><u>IEC</u>: -- <li><u>JEITA</u>: SC-603</ul> >VALUE >NAME <li><b>SOT101</b><hr> <ul><li>DIP24: plastic dual in-line package; 24 leads (600 mil) <li><u>JEDEC</u>: MO-015 <li><u>IEC</u>: 051G02 <li><u>JEITA</u>: SC-509-24</ul> >NAME >VALUE <li><b>SOT222</b><hr> <ul><li>DIP24: plastic dual in-line package; 24 leads (300 mil) <li><u>JEDEC</u>: MS-001 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT117</b><hr> <ul><li>DIP28: plastic dual in-line package; 28 leads (600 mil) <li><u>JEDEC</u>: MO-015 <li><u>IEC</u>: 051G05 <li><u>JEITA</u>: SC-510-28</ul> >NAME >VALUE <li><b>SOT129</b><hr> <ul><li>DIP40: plastic dual in-line package; 40 leads (600 mil) <li><u>JEDEC</u>: MO-015 <li><u>IEC</u>: 051G08 <li><u>JEITA</u>: SC-511-40</ul> >NAME >VALUE <li><b>SOT240</b><hr> <ul><li>DIP48: plastic dual in-line package; 48 leads (600 mil) <li><u>JEDEC</u>: MS-011 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT762</b><hr> <ul><li>DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm <li><u>JEDEC</u>: MO-241 <li><u>IEC</u>: -- <li><u>JEITA</u>: -- </ul> >VALUE >NAME <li><b>SOT763</b><hr> <ul><li>DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm <li><u>JEDEC</u>: MO-241 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT815</b><hr> <ul><li>DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT815 <li><b>SOT564</b><hr> <ul><li>HBCC24: plastic thermal enhanced bottom chip carrier; 24 terminals; body 4 x 4 x 0.65 mm <li><u>JEDEC</u>: MO-217 <li><u>IEC</u>: -- <li><u>JEITA</u>: -- </ul> >VALUE >NAME <li><b>SOT360</b><hr> <ul><li>TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm <li><u>JEDEC</u>: MO-153 <li><u>IEC</u>: </ul> >VALUE >NAME <li><b>SOT527</b><hr> <ul><li>HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad <li><u>JEDEC</u>: MO-153 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT487</b><hr> <ul><li>TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm <li><u>JEDEC</u>: MO-153 <li><u>IEC</u>: -- <li><u>JEITA</u>: -- </ul> >VALUE >NAME <li><b>SOT549-1</b><hr> <ul><li>HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;body width 6.1 mm; lead pitch 0.65 mm; exposed die pad <li><u>JEDEC</u>: MO-153 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> MK >VALUE >NAME <b>Dual In Line Package</b> >VALUE >NAME <li><b>SOT1194</b><hr> <ul><li>HUSON4: plastic thermal enhanced ultra thin small outline package; no leads;4 terminals; body 1 x 1 x 0.55 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: --</ul> >VALUE >NAME !!!!!!Experimental, not tested!!!!!!!!!!!! MK <li><b>SOT1115</b><hr> <ul><li>XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1.0 x 0.35 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1115 <li><b>SOT404</b><hr> <ul><li>Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped) <li><u>JEDEC</u>: -- <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT684</b><hr> <ul><li>HVQFN56: plastic thermal enhanced very thin quad flat package; no leads;56 terminals; body 8 x 8 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: --</ul> >VALUE >NAME JENNIC QFN56, NO SOT number. Equals to HVQFN56 (SOT684) without heatsink. Foutprint based on SOT684. >NAME >VALUE <li><b>NX3P190/NX3P191</b><hr> <ul><li>WLCSP4: wafer level chip-size package. 4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included) <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE <li><b>SOT428</b><hr> <ul><li>Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped) <li><u>JEDEC</u>: TO-252 <li><u>IEC</u>: -- <li><u>JEITA</u>: SC-63</ul> >NAME >VALUE <li><b>SOT629</b><hr> <ul><li>HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm <li><u>JEDEC</u>: MS-220 <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT758-1</b><hr> <ul><li>HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: -- </ul> >VALUE >NAME <li><b>SOT758-3</b><hr> <ul><li>HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: -- </ul> >VALUE >NAME <li><b>SOT662</b><hr> <ul><li>HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 x 5 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: -- </ul> >VALUE >NAME <li><b>SOT788</b><hr> <ul><li>HVQFN28: plastic thermal enhanced very thin quad flat package; no leads; 28 terminals; body 6 x 6 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT778-1</b><hr> <ul><li>HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT778-4</b><hr> <ul><li>HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT804-1</b><hr> <ul><li>HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT804-1 <li><b>SOT804-2</b><hr> <ul><li>HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT804-2 <li><b>SOT804-3</b><hr> <ul><li>HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT804-3 <li><b>SOT804-4</b><hr> <ul><li>HVQFN64: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT804-4 <li><b>SOT650</b><hr> <ul><li>HVSON10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 x 3 x 0.85 mm <li><u>JEDEC</u>: MO-229 <li><u>IEC</u>: -- <li><u>JEITA</u>:--</ul> >VALUE >NAME <li><b>SOT994</b><hr> <ul><li>HWQFN24: plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.75 mm <li><u>JEDEC</u>: <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT994 <li><b>SOT1031-2</b><hr> <ul><li>HWQFN48R: plastic thermal enhanced very very thin quad flat package; no leads 48 terminals; resin based; body 7 x 7 x 0.7 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1031-2 <li><b>SOT1031-1</b><hr> <ul><li>HWQFN48R: plastic thermal enhanced very very thin quad flat package; no leads 48 terminals; resin based; body 7 x 7 x 0.7 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1031-1 <li><b>SOT1046</b><hr> <ul><li>HXQFN16U: plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals; UTLP based; body 2 x 2 x 0.5 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1046 <li><b>SOT1133-1</b><hr> <ul><li>HXQFN60U: plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals; UTLP based; body 5 x 5 x 0.5 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT1134-1</b><hr> <ul><li>HXQFN60U: plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals; UTLP based; body 4 x 6 x 0.5 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1134-1 <li><b>SOT102</b><hr> <ul><li>DIP18: plastic dual in-line package; 18 leads (300 mil) <li><u>JEDEC</u>: -- <li><u>IEC</u>: MS-001 <li><u>JEITA</u>: --</ul> >NAME >VALUE <b>Dual In Line</b> 0.4 inch >VALUE >NAME <li><b>SOT135</b><hr> <ul><li>Ceramic dual in-line package; 28 leads; glass seal <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE <li><b>SOT337</b><hr> <ul><li>SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm <li><u>JEDEC</u>: MO-150 <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT338</b><hr> <ul><li>SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm <li><u>JEDEC</u>: MO-150 <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT369</b><hr> <ul><li>SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm <li><u>JEDEC</u>: MO-152 <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT266</b><hr> <ul><li>SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm <li><u>JEDEC</u>: MO-152 <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT339</b><hr> <ul><li>SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm <li><u>JEDEC</u>: MO-150 <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT340</b><hr> <ul><li>SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm <li><u>JEDEC</u>: MO-150 <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT341</b><hr> <ul><li>SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm <li><u>JEDEC</u>: MO-150 <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT519</b><hr> <ul><li>SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: -- </ul> >VALUE >NAME <li><b>SOT556</b><hr> <ul><li>SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm <li><u>JEDEC</u>: MO-137 <li><u>IEC</u>: -- <li><u>JEITA</u>: -- </ul> >VALUE >NAME <li><b>SOT370</b><hr> <ul><li>SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm <li><u>JEDEC</u>: MO-118 <li><u>IEC</u>: </ul> >VALUE >NAME <li><b>SOT549-3</b><hr> <ul><li>HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad <li><u>JEDEC</u>: MO-153 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT619-2/3</b><hr> <ul><li>HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE <li><b>SOT619-4/8</b><hr> <ul><li>HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT619-5/6</b><hr> <ul><li>HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> MK >VALUE >NAME <li><b>SOT619-7</b><hr> <ul><li>HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> MK >VALUE >NAME <li><b>SOT619-9</b><hr> <ul><li>HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> MK >VALUE >NAME <li><b>SOT619-11</b><hr> <ul><li>HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> MK >VALUE >NAME <li><b>SOT758-2</b><hr> <ul><li>HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: -- </ul> MK >VALUE >NAME <li><b>SOT778-2</b><hr> <ul><li>HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT778-3</b><hr> <ul><li>HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT778-5</b><hr> <ul><li>HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT865-2</b><hr> <ul><li>HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT865-2 <li><b>SOT865-1</b><hr> <ul><li>HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm <li><u>JEDEC</u>: MO-220 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT865-1 <li><b>SOT1155-2</b><hr> <ul><li>TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 4.5 x 4.5 x 0.7 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1155-2 <li><b>SOT1165-1</b><hr> <ul><li>XSON10: plastic, extremely thin small outline package; no leads; 10 terminals; body 1 x 2.5 x 0.5 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: --</ul> >NAME >VALUE SOT1165-1 SOT753 <br> >VALUE >NAME <li><b>SOT902</b><hr> <ul><li>XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: ---</ul> >VALUE >NAME SOT902 <li><b>SOD323(F)</b><hr> <ul><li>Plastic surface-mounted package; 2 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: SC-90</ul> >NAME >VALUE <b>SOT 666 Reflow soldering foorprint</b><p> Source: Philips - BAS70_1PS7XSB70_SER_8.pdf >VALUE >NAME <li><b>SOD68</b><hr> <ul><li>Hermetically sealed glass package; axial leaded; 2 leads <li><u>JEDEC</u>: DO-34 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE <li><b>SOT323</b><hr> <ul><li>Plastic surface-mounted package; 3 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: SC-70</ul> >VALUE >NAME <li><b>SOT416</b><hr> <ul><li>Plastic surface-mounted package; 3 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: SC-75</ul> >VALUE >NAME <b>TO 92</b> 2 3 1 >NAME >VALUE >NAME >VALUE <li><b>SOT883(B)</b><hr> <ul><li>Plastic surface-mounted package; 3 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: SC-101</ul> Remark: SOT883B has the same footprint, package is lower >VALUE >NAME SOT883(B) <li><b>SOT490</b><hr> <ul><li>Plastic surface-mounted package; 3 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: SC-89</ul> >VALUE >NAME <li><b>SOT1263</b><hr> <ul><li>Microlead ultra small surface-mounted plastic package; 3 leads<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1263 2 3 1 >NAME >VALUE <li><b>SOT116</b><hr> <ul><li>DIP22: plastic dual in-line package; 22 leads (400 mil) <li><u>JEDEC</u>: MS-010 <li><u>IEC</u>: 060G07 <li><u>JEITA</u>: SC-502-22</ul> >NAME >VALUE <li><b>SOT111</b><hr> <ul><li>DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> 1 >NAME >VALUE <li><b>SOT247</b><hr> <ul><li>SDIP52: plastic shrink dual in-line package; 52 leads (600 mil) <li><u>JEDEC</u>: MS-020 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT270</b><hr> <ul><li>SDIP42: plastic shrink dual in-line package; 42 leads (600 mil) <li><u>JEDEC</u>: MS-020 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT274</b><hr> <ul><li>SDIP64: plastic shrink dual in-line package; 64 leads (750 mil) <li><u>JEDEC</u>: MS-021 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT400</b><hr> <ul><li>SDIP56: plastic shrink dual in-line package; 56 leads (600 mil) <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT110</b><hr> <ul><li>SIL9MPF: plastic single in-line medium power package with fin; 9 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> 1 >NAME >VALUE <li><b>SOT1188</b><hr> <ul><li>SIL4: plastic, single in-line package <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1188 <li><b>SOT131</b><hr> <ul><li>SIL9P: plastic single in-line power package; 9 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> 1 >NAME >VALUE <li><b>SOT142</b><hr> <ul><li>SIL9MP: plastic single in-line medium power package; 9 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> 1 >VALUE >NAME <li><b>SOT193</b><hr> <ul><li>SIL13P: plastic single in-line power package; 13 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> 1 >VALUE >NAME <li><b>SOT352</b><hr> <ul><li>RBS9MPF: plastic rectangular-bent single in-line medium power package with fin; 9 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT578</b><hr> <ul><li>TBS13P: plastic Triple-bent-SIL power package; 13 leads (lead length 7.7 mm) <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> 1 >VALUE >NAME <li><b>SOT143(B)</b><hr> <ul><li>Plastic surface-mounted package; 4 leads<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE <li><b>SOT23</b><hr> <ul><li>Plastic surface-mounted package; 3 leads<li><u>JEDEC</u>: TO-236AB <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE <li><b>SOT680</b><hr> <ul><li>SO5: plastic small outline package; 5 leads; body width 1.6 mm<li><u>JEDEC</u>: MO-178 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME >VALUE >NAME <li><b>SOT1118</b><hr> <ul><li>HUSON6: plastic, thermal enhanced ultra thin small outline package; no leads;6 terminals; body 2 x 2 x 0.65 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE SOT1118 <li><b>SOT996-2/3</b><hr> <ul><li>XSON8U: plastic extremely thin small outline package; no leads;8 terminals; UTLP based; body 3 x 2 x 0.5 mm <li><u>JEDEC</u>: <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT996-2/3 <li><b>SOT1069</b><hr> <ul><li>HWSON8: plastic thermal enhanced very very thin small outline package; no leads;8 terminals; body 2 x 3 x 0.75 mm <li><u>JEDEC</u>: <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1069 <li><b>SOT78</b><hr> <ul><li>Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB <li><u>JEDEC</u>: 3-lead TO-220AB <li><u>IEC</u>: -- <li><u>JEITA</u>: SC-46</ul> >NAME >VALUE <b>Molded Package</b><p> grid 2.54 mm >VALUE >NAME <li><b>SOT1210</b><hr> <ul><li>Plastic single ended surface mounted package (LFPAK33); 8 leads <li><u>JEDEC</u>: --- <li><u>IEC</u>: ---</ul> >VALUE >NAME SOT1210 <li><b>SOT1134-2</b><hr> <ul><li>HXQFN60U: plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals; UTLP based; body 4 x 6 x 0.5 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1134-2 <li><b>SOD113</b><hr> <ul><li>Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 2-lead TO-220 'full pack <li><u>JEDEC</u>: 2-lead TO-220F <li><u>IEC</u>: --</ul> >VALUE >NAME <li><b>SOT357-1</b><hr> <ul><li>TQFP64: plastic thin quad flat package; 64 leads; body 10 x 10 x 1.0 mm <li><u>JEDEC</u>: MS-026 <li><u>IEC</u>: 137E10 <li><u>JEITA: --</ul> >VALUE >NAME SOT357-1 <li><b>SOT1089-1</b><hr> <ul><li>XSON8: plastic, extremely thin small outline package; no leads; 8 terminals; body 1 x 1.35 x 0.5 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1089-1 <li><b>SOT1160-1</b><hr> <ul><li>XQFN10: plastic, extremely thin quad flat package; no leads;10 terminals; body 1.40 x 1.80 x 0.50 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1160-1 <li><b>SOT505-2</b><hr> <ul><li>TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: --</ul> >VALUE >NAME >NAME >VALUE <li><b>SOD123F</b><hr> <ul><li>Plastic surface-mounted package; 2 leads <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE >NAME >VALUE <li><b>SOT1226</b><hr> <ul><li>X2SON5: plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 x 0.8 x 0.35 mm<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1226 <li><b>SOD882(T)</b><hr> <ul><li>Leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE <li><b>SOT143R</b><hr> <ul><li>Plastic surface-mounted package; reverse pinning; 4 leads<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: SC-61AA</ul> >NAME >VALUE <li><b>SOT882D</b><hr> <ul><li>Leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE <li><b>SOT346</b><hr> <ul><li>Plastic surface-mounted package; 3 leads<li><u>JEDEC</u>: TO-236 <li><u>IEC</u>: -- <li><u>JEITA</u>: SC-59A</ul> >VALUE >NAME <li><b>SOT123W</b><hr> <ul><li>Plastic surface-mounted package; 2 leads<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE <li><b>SOT1061</b><hr> <ul><li>HUSON3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT1220</b><hr> <ul><li>DFN2020MD-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT1023</b><hr> <ul><li>Plastic single-ended surface-mounted package (LFPAK); 4 leads<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1023 <li><b>SOT873-1</b><hr> <ul><li>DFN3333-8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3.3 x 3.3 x 1.0 mm<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT226</b><hr> <ul><li>Plastic single-ended package (I2PAK); low-profile 3-lead TO-262 <li><u>JEDEC</u>: TO-262 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE <li><b>SOT429</b><hr> <ul><li>Plastic single-ended through-hole package; heatsink mounted; 1 mounting hole; 3-lead TO-247 <li><u>JEDEC</u>: TO-247 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE <li><b>SOT765</b><hr> <ul><li>VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm <li><u>JEDEC</u>: MO-187 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT1203</b><hr> <ul><li>XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.0 x 0.35 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1203 <li><b>SOT833-1</b><hr> <ul><li>XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm <li><u>JEDEC</u>: MO-252 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT1081-1</b><hr> <ul><li>XSON10U: plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 1.7 x 0.5 mm <li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME SOT1081-1 <li><b>SOT1122</b><hr> <ul><li>XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm <li><u>JEDEC</u>: MO-252 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >NAME >VALUE SOT1122 >VALUE >NAME >VALUE >NAME <li><b>SOT355-1</b><hr> <ul><li>TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm<li><u>JEDEC</u>: MO-153 <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT1199-1</b><hr> <ul><li>VFBGA24: plastic very thin fine-pitch ball grid array package; 24 balls; body 3 x 3 x 0.65 mm<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME <li><b>SOT1176</b><hr> <ul><li>XSON10: plastic extremely thin small outline package; no leads; 10 terminals; body 1 x 2.5 x 0.5 mm<li><u>JEDEC</u>: -- <li><u>IEC</u>: -- <li><u>JEITA</u>: --</ul> >VALUE >NAME >VALUE >NAME >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE Diode >NAME >VALUE >NAME >VALUE >VALUE >NAME >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >VALUE >NAME >VALUE >NAME >NAME >VALUE Vref Control ADJ VOUT VIN >NAME >VALUE Vref Control GND Vin Vout Array VCC GND >NAME >VALUE EEPROM EN SDAI SCLI DIR SDA SCL >VALUE >NAME >NAME >NAME >NAME GND VCC >NAME >VALUE VCC VEE >NAME >VALUE >NAME >NAME >VALUE >VALUE >NAME >NAME >VALUE VCC GND >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE VCC GND1 GND2 GND2 >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >VALUE >NAME >VALUE >NAME >NAME >VALUE >VALUE >NAME >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >NAME >VALUE >NAME >VALUE >NAME EN A1 A2 B1 B2 >VALUE >NAME RF_IN RF_OUT >NAME >VALUE >NAME >VALUE >NAME >VALUE 1 >NAME >VALUE 1 >NAME >VALUE >NAME GND VCC >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE R1 R2 >NAME >VALUE R1 >NAME >VALUE R1 >NAME >VALUE R1 R2 >NAME >VALUE >NAME >VALUE >NAME >VALUE >VALUE >NAME >VALUE >NAME >NAME >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >VALUE >NAME >NAME >VALUE >NAME >VALUE >NAME >VALUE 1D- 2D- D- >NAME >VALUE S 1D+ 2D+ D+ >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >VALUE >NAME >NAME >VALUE >NAME >VALUE >NAME >VALUE 1 >NAME >VALUE & >NAME >VALUE & >NAME >VALUE =1 >NAME >VALUE & >NAME >VALUE & >NAME >VALUE >1 >NAME >VALUE >1 >NAME >VALUE & >NAME >VALUE & >NAME >VALUE 1 >NAME >VALUE >NAME >VALUE 1 >NAME >VALUE VCC GND CTRL >NAME >VALUE >NAME >VALUE >NAME >VALUE VCC GND EN >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >VALUE >NAME >VALUE >NAME >VALUE >NAME NXP ARM M0 32 bit Microcontroller<p> <author>AAL Eindhoven MV+ MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>HV start-up flyback controller with integrated MOSFET for 5 W applications</H2> The TEA1721 is a small and low cost module Switched Mode Power Supply (SMPS) controller IC for low power applications (up to 5 W) and operates directly from the rectified universal mains input. The device includes a high voltage power switch (700 V) and has been optimized for flyback converter topologies to provide high-efficiency over the entire load range with ultra-low power consumption in the no-load condition. It provides a circuit for start-up directly from the rectified mains voltage without any external bleeder circuits. The converter operates as a regulated voltage source from no-load up to the maximum output current and operates as current source that delivers the maximum current over a broad output voltage range. Using the TEA1721, a low power converter can be built at minimum cost and with the minimum number of external components. The controller regulates the output voltage with primary-side sensing which eliminates the need for an additional secondary feedback circuitry and simplifies the design. At higher power levels, a frequency and current control mode is used. It operates with Burst mode control at low power levels and no-load condition. The burst mode minimizes audible noise and provides an energy saver state which reduces the power consumption in no-load condition. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> NXP Capacitive 8-channel proximity switch with auto-calibration and very low power consumption<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> Planar passivated high commutation three quadrant triac in a SOT78 plastic package intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur<p><author>AAL Eindhoven MV+ MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> Planar passivated high commutation three quadrant triac in a SOT78 plastic package intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur<p><author>AAL Eindhoven MV+ MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>AC Thyristor power switch</H2>AC Thyristor power switch in a SOT223 surface-mountable plastic package with self-protective capabilities against low and high energy transients<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> Single high-speed switching diodes, fabricated in planar technology, and encapsulated in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) packages. <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> ESD protection <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> NXP ARM M0 32 bit Microcontroller<p> <author>AAL Eindhoven MV+ MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> NXP ISO14443 ISO15693 reader IC <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/bbimages/NXP_logo.gif"> NXP TVS Diode <p> <author>AAL Eindhoven MK</author><hr><p> <img src=http://www.nxp.com/bbimages/NXP_logo.gif> <b>LPC1111 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p>Pacjake according to datasheet <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1112 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1113 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1114 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1114 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1311 </b><p>72 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 8 kB Flash, 4 kB SRAM </p><author>MarcVl - Datasheet available on www.nxp.com</author><p> Modified by MK: added second HVQFN33 package according datasheet specification. <p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1313 </b><p>72 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 32 kB Flash, 8 kB SRAM </p><author>MarcVl - Datasheet available on www.nxp.com</author> <p><img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1313 </b><p>72 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 32 kB Flash, 8 kB SRAM </p><author>MarcVl - Datasheet available on www.nxp.com</author><p> Modified by MK: added second HVQFN33 package according datasheet specification. <p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1342 </b><p>72 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 16 kB Flash, 4 kB SRAM, USB Device </p><author>MarcVl - Datasheet available on www.nxp.com</author><p> Modified by MK: added second HVQFN33 package according datasheet specification. <p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1343 </b><p>72 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 32 kB Flash, 8 kB SRAM, USB Device </p><author>MarcVl - Datasheet available on www.nxp.com</author> <p><img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1343 </b><p>72 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 32 kB Flash, 8 kB SRAM, USB Device </p><author>MarcVl - Datasheet available on www.nxp.com</author><p> Modified by MK: added second HVQFN33 package according datasheet specification. <p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1751 </b><p>100 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 32 kB Flash, 8 kB SRAM, USB Device, CAN </p><author>MarcVl - Datasheet available on www.nxp.com</author> <p><img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1752 </b><p>100 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 64 kB Flash, 16 kB SRAM, USB Device, CAN </p><author>MarcVl - Datasheet available on www.nxp.com</author> <p><img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1754 </b><p>100 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 128 kB Flash, 32 kB SRAM, USB Device/Host/OTG, CAN, DAC </p><author>MarcVl - Datasheet available on www.nxp.com</author> <p><img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1756 </b><p>100 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 256 kB Flash, 32 kB SRAM, USB Device/Host/OTG, 2 CAN, DAC </p><author>MarcVl - Datasheet available on www.nxp.com</author> <p><img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1758 </b><p>100 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 512 kB Flash, 64 kB SRAM, USB Device/Host/OTG, 2 CAN, DAC, Ethernet </p><author>MarcVl - Datasheet available on www.nxp.com</author> <p><img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1764 </b><p>100 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 128 kB Flash, 32 kB SRAM, USB Device, 2 CAN, Ethernet </p><author>MarcVl - Datasheet available on www.nxp.com</author> <p><img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1765 </b><p>100 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 256 kB Flash, 64 kB SRAM, USB Device/Host/OTG, 2 CAN, DAC </p><author>MarcVl - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1766 </b><p>100 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 256 kB Flash, 64 kB SRAM, USB Device/Host/OTG, 2 CAN, DAC, Ethernet </p><author>MarcVl - Datasheet available on www.nxp.com</author> <p><img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1768 </b><p>100 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 512 kB Flash, 64 kB SRAM, USB Device/Host/OTG, 2 CAN, DAC, Ethernet </p><author>MarcVl - Datasheet available on www.nxp.com</author> <p><img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1768 </b><p>100 MHz 32-bit ARM Cortex-M3 based microcontroller featuring a high level of integration and low power consumption. 512 kB Flash, 64 kB SRAM, USB Device/Host/OTG, 2 CAN, DAC, Ethernet </p><author>MarcVl - Datasheet available on www.nxp.com</author><p> <author>Package added by AAL Eindhoven MV+ MK</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> The NX1117C/NX1117CE are two series of low-dropout positive voltage regulators with an output current capability of 1 A.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> The NX1117C/NX1117CE are two series of low-dropout positive voltage regulators with an output current capability of 1 A.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> The NX1117C/NX1117CE are two series of low-dropout positive voltage regulators with an output current capability of 1 A.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> The PCF8594C-2 is a ?oating gate Electrically Erasable Programmable Read Only Memory (EEPROM) with 4 kbits (512 × 8-bit) non-volatile storage. <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> The PCA9525 is a monolithic CMOS integrated circuit for bus buffering in applications including I2C-bus, SMBus, DDC, PMBus, and other systems based on similar principles.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> The PCA9605 is a monolithic CMOS integrated circuit for bus buffering in applications including I2C-bus, SMBus, DDC, PMBus, and other systems based on similar principles.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> The PCA9646 is a monolithic CMOS integrated circuit for 2-wire bus buffering and switching in applications including I2C-bus, SMBus, PMBus, and other systems based on similar principles.<p> <author>AAL Eindhoven MK</author><hr><p> <img src=http://www.nxp.com/img/NXP_logo.png> <H2>Inverters with open-drain outputs</H2>The 74LVC2G06 provides two inverting buffers. The output of this device is an open drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions. Input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall time. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> The TEA1795T is a member of the new generation of Synchronous Rectifier (SR) controller ICs for switched mode power supplies. Its high level of integration enables the design of a cost-effective power supply with a minimum number of external components.<p> <author>AAL Eindhoven MK</author><hr><p> <img src=http://www.nxp.com/bbimages/NXP_logo.gif> Ultra low capacitance unidirectional ElectroStatic Discharge (ESD) protection diode in a SOD523 (SC-79) ultra small and flat lead Surface-Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients.<p> <author>AAL Eindhoven MK</author><hr><p> <img src=http://www.nxp.com/img/NXP_logo.png> DisplayPort multiplexer for bidirectional video<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/bbimages/NXP_logo.gif"> <H2>Low-power configurable gate with voltage-level translator</H2>The 74AUP1T57 provides low-power, low-voltage configurable logic gate functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter and buffer. All inputs can be connected to VCC or GND. This device ensures a very low static and dynamic power consumption across the entire VCC range from 2.3 V to 3.6 V. The 74AUP1T57 is designed for logic-level translation applications with input switching levels that accept 1.8 V low-voltage CMOS signals, while operating from either a single 2.5 V or 3.3 V supply voltage. The wide supply voltage range ensures normal operation as battery voltage drops from 3.6 V to 2.3 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. Schmitt trigger inputs make the circuit tolerant to slower input rise and fall times across the entire VCC range.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low-power configurable multiple function gate</H2>The 74AUP1G58 provides configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XOR, inverter and buffer. All inputs can be connected to VCC or GND. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. The 74AUP1G58 has Schmitt trigger inputs making it capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. The inputs switch at different points for positive and negative-going signals. The difference between the positive voltage VT+ and the negative voltage VT- is defined as the input hysteresis voltage VH.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> High-performance DisplayPort Gen2 2 : 1 multiplexer<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/bbimages/NXP_logo.gif"> Resonant power supply control IC with PFC.<p> <author>AAL Eindhoven MK</author><hr><p> <img src=http://www.nxp.com/bbimages/NXP_logo.gif> The NX3L2467 is a dual low-ohmic double-pole double-throw analog switch suitable for use as an analog or digital multiplexer/demultiplexer. It consists of four switches, each with two independent input/outputs (nY0 and nY1) and a common input/output (nZ). The two digital inputs (1S and 2S) are used to select the switch position. 1S is used in selecting the independent inputs/outputs switched to 1Z and 2Z, and 2S is used in selecting the independent inputs/outputs switched to 3Z and 4Z. Schmitt trigger action at the select input (nS) makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 1.4 V to 4.3 V.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> CBTL02043A/B is a 2 differential channel, 2-to-1 multiplexer/demultiplexer switch for PCI Express Generation 3 (Gen3), or other high-speed serial interface applications. The CBTL02043A/B can switch two differential signals to one of two locations. Using a unique design technique, NXP has minimized the impedance of the switch such that the attenuation observed through the switch is negligible, and also minimized the channel-to-channel skew as well as channel-to-channel crosstalk, as required by the high-speed serial interface. CBTL02043A/B allows expansion of existing high speed ports for extremely low power.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/bbimages/NXP_logo.gif"> <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/bbimages/NXP_logo.gif"> The GreenChip III is the third generation of green Switched Mode Power Supply (SMPS) controller ICs. The GreenChip III combines a controller for Power Factor Correction (PFC) and a flyback controller. Its high level of integration allows the design of a cost-effective power supply with a very low number of external components.<p> <author>AAL Eindhoven MK</author><hr><p> <img src=http://www.nxp.com/bbimages/NXP_logo.gif> The TEA1791AT is a member of the new generation of Synchronous Rectifier (SR) controller ICs for switched mode power supplies. Its high level of integration allows the design of a cost-effective power supply with a very low number of external components.<p> <author>AAL Eindhoven MK</author><hr><p> <img src=http://www.nxp.com/bbimages/NXP_logo.gif> The TEA1738(T) is a low cost Switched Mode Power Supply (SMPS) controller IC intended for flyback topologies. The TEA1738(T) operates in peak current and frequency control mode. To reduce Electro Magnetic Interference (EMI), frequency jitter has been implemented. Slope compensation is integrated for Continuous Conduction Mode (CCM) operation.<p> <author>AAL Eindhoven MK</author><hr><p> <img src=http://www.nxp.com/bbimages/NXP_logo.gif> Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 plastic SMD package.<p> <author>AAL Eindhoven MV+ MK</author><hr><p> <img src="http://www.nxp.com/bbimages/NXP_logo.gif"> The PCF8523 is a CMOS Real-Time Clock (RTC) and calendar optimized for low power consumption. Data is transferred serially via an I2C-bus with a maximum data rate of 1000 kbit/s. Alarm and timer functions are available with the possibility to generate a wake-up signal on an interrupt pin. An offset register allows fine-tuning of the clock. The PCF8523 has a backup battery switch-over circuit, which detects power failures and automatically switches to the battery supply when a power failure occurs.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> The PCF8523 is a CMOS Real-Time Clock (RTC) and calendar optimized for low power consumption. Data is transferred serially via an I2C-bus with a maximum data rate of 1000 kbit/s. Alarm and timer functions are available with the possibility to generate a wake-up signal on an interrupt pin. An offset register allows fine-tuning of the clock. The PCF8523 has a backup battery switch-over circuit, which detects power failures and automatically switches to the battery supply when a power failure occurs.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>AC Thyristor power switch</H2>An AC Thyristor power switch with very high noise immunity and over-voltage protection configured for negative gate triggering in a SOT96-1 (SO8) small surface-mountable plastic package<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>4Q Triac</H2> Planar passivated sensitive gate four quadrant triac in a SOT223 (SC-73) surface-mountable plastic package intended for applications requiring enhanced immunity to noise and direct interfacing to logic level ICs and low power gate drivers. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low-dropout regulators, high PSRR, 150 mA</H2> The LD6805 series is a small-size Low DropOut regulator (LDO) family with ultra high Power Supply Rejection Ratio (PSRR) of 75 dB. The voltage drop is 250 mV at 150 mA current rating. Operating voltages can range from 2.3 V to 5.5 V. The devices are available with fixed output voltages between 1.2 V to 3.6 V. The LD6805K/xxH devices show a high-ohmic state at the output pin when set to disabled mode. The LD6805K/xxP devices contain a pull-down switching transistor to provide a low-ohmic output state (auto discharge function) in disabled mode. The LD6805 series devices are available in a 1 x 1 mm DFN plastic package making them ideal for use in portable applications requiring component miniaturization. All devices are manufactured in monolithic silicon technology.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> PLEASE CHECK AOUT+ AND AOUT-<p> PTN36241B is a USB 3.0 (SuperSpeed) re-driver that enhances signal quality by performing receive equalization on the deteriorated input signal followed by transmit de-emphasis maximizing system link performance. With its superior differential signal conditioning and enhancement capability, the device delivers significant flexibility and performance scaling for various systems with different PCB trace and cable channel conditions and still benefit from optimum power consumption. PTN36241B is a dual-channel (channel A and channel B) device that supports data signaling rate of 5 Gbit/s through each channel. PTN36241B is flexibly powered from 3.3 V and is available in HVQFN24 4 mm × 4 mm package with 0.5 mm pitch. <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Ultra low-dropout regulator, low noise, 200 mA</H2> The LD6806 series is a small-size Low-DropOut regulator (LDO) family with a typical voltage drop of 60 mV at 200 mA current rating. The device is available in three different surface-mounted packages, one 0.4 mm pitch CSP, one leadless plastic package SOT886 and one gull wing package SOT753. The operating voltage ranges from 2.3 V to 5.5 V and the output voltage ranges from 1.2 V to 3.6 V. LD6806x/xxH devices show a high-ohmic state at the output pin, while the LD6806x/xxP contains a pull-down switching transistor, to provide a low-ohmic output stage when the device is disabled. All devices use the same regulator design and are manufactured in monolithic silicon technology. These features make the LD6806 series ideal for use in applications requiring component miniaturization, such as mobile phone handsets, cordless telephones and personal digital devices.<p><img src="http://www.nxp.com/img/NXP_logo.png"> <H2>N-channel TrenchMOS intermediate level FET</H2>Intermediate level gate drive N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using advanced TrenchMOS technology. This product has been designed and qualified to the appropriate AEC Q101 standard for use in high performance automotive applications.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC12D27</b><p> 32-bit ARM Cortex-M0 microcontroller; 128 kB flash and 8 kB SRAM; 40 segment x 4 LCD driver<p> <author>AAL Eindhoven MK</author><hr><p> <img src=http://www.nxp.com/img/NXP_logo.png> The PCA9661 is an advanced single master mode I2C-bus controller. It is a fourth generation bus controller designed for data intensive I2C-bus data transfers. <author>AAL Eindhoven MK</author><hr><p> <img src=http://www.nxp.com/img/NXP_logo.png> <h3>NXP Semiconductors</h3> <p><h4>Attention: Pin PIO1_5 is not available in the LQFP48 package, whereas PIO1_31 is not available in the TFBGA48 package!</h4><p> <a href="http://ics.nxp.com/products/lpc1000/lpc11xx/"><b>LPC11Uxx</b> microcontrollers</a> <ul> <li>ARM 32-bit Cortex-M0 Microcontroller with MPU</li> <li>CPU clock up to 50MHz</li> <li>Up to 32KByte on-chip Flash ROM with In-System Programming (ISP) and In-Application Programming (IAP) via On-Chip Bootloader</li> <li>Up to 8KByte SRAM</li> <li>Nested Vectored Interrupt Controller</li> <li>Up to 2 SPI controllers</li> <li>USB 2.0 device controller</li> <li>USART with full Modem Interface and RS485 Support and ISO7816-3 support</li> <li>Fast Mode I2C-Bus</li> <li>4 Timers with 4 capture channels and 13 output channels</li> <li>Watchdog (WDT)</li> <li>Sytem tick timer</li> <li>10-bit ADC with 8 channels</li> <li>Power Management Unit (PMU)</li> <li>Brownout detection</li> <li>12MHz internal RC oscillator</li> <li>Serial Wire Debug/Trace port</li> </ul> Symbol copied from RH, package adapted to NXP spec (MK) <h3>NXP Semiconductors</h3> <p><h4>The LPC11U1x also comes in a LQFP44 and TFBGA48 package with more pins.</h4><p> <a href="http://ics.nxp.com/products/lpc1000/lpc11xx/"><b>LPC11Uxx</b> microcontrollers</a> <ul> <li>ARM 32-bit Cortex-M0 Microcontroller with MPU</li> <li>CPU clock up to 50MHz</li> <li>Up to 32KByte on-chip Flash ROM with In-System Programming (ISP) and In-Application Programming (IAP) via On-Chip Bootloader</li> <li>Up to 8KByte SRAM</li> <li>Nested Vectored Interrupt Controller</li> <li>Up to 2 SPI controllers</li> <li>USB 2.0 device controller</li> <li>USART with full Modem Interface and RS485 Support and ISO7816-3 support</li> <li>Fast Mode I2C-Bus</li> <li>4 Timers with 4 capture channels and 13 output channels</li> <li>Watchdog (WDT)</li> <li>Sytem tick timer</li> <li>10-bit ADC with 8 channels</li> <li>Power Management Unit (PMU)</li> <li>Brownout detection</li> <li>12MHz internal RC oscillator</li> <li>Serial Wire Debug/Trace port</li> </ul> Symbol copied from RH, package adapted to NXP spec (MK) <H2>ESD protection for in-vehicle ultra high-speed interfaces</H2> The device is designed to protect in-vehicle ultra high-speed interfaces in automotive applications, such as Low-Voltage Differential Signaling (LVDS), High-Definition Multimedia Interface (HDMI) and DisplayPort interfaces against ElectroStatic Discharge (ESD).<p> <author>AAL Eindhoven MK</author><hr><p> <img src=http://www.nxp.com/img/NXP_logo.png> <b>LPC1110 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1111 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1112 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1112</b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1112 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1114 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1112 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1114 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1114 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Single 2-input OR gate</H2> The 74LVC1G32 provides one 2-input OR function. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V applications. Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall time. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>N-channel TrenchMOS logic level FET</H2>Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. This product has been designed and qualified to the appropriate AEC standard for use in automotive critical applications. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low-power configurable gate</H2>The 74AUP1G57 provides configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and buffer. All inputs can be connected to VCC or GND. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. The 74AUP1G57 has Schmitt trigger inputs making it capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. The inputs switch at different points for positive and negative-going signals. The difference between the positive voltage VT+ and the negative voltage VT- is defined as the input hysteresis voltage VH.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> Switch mode power supply controller<p> <author>AAL Eindhoven MK</author><hr><p> <img src=http://www.nxp.com/bbimages/NXP_logo.gif> The PCA9509A is a level translating I2C-bus/SMBus repeater with two voltage supplies that enables processor low voltage 2-wire serial bus to interface with standard I2C-bus or SMBus I/O.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> The PCA9509 is a level translating I2C-bus/SMBus repeater with two voltage supplies that enables processor low voltage 2-wire serial bus to interface with standard I2C-bus or SMBus I/O.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Quad bus BUFFER, 3-state</H2>The 74ABT125 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT125 device is a quad buffer that is ideal for driving bus lines. The device features four Output Enables (1OE, 2OE, 3OE, 4OE), each controlling one of the 3-state outputs.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>500 mA low VF dual MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>NPN general purpose transistor</H2>NPN transistor in a SOT23 plastic package. PNP complement: BCX17.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>PNP general purpose transistors</H2> PNP transistor in a SOT23 plastic package. NPN complement: BCX19.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <b>LPC1113 </b><p>50 MHz 32-bit ARM Cortex-M0 based microcontroller featuring a high level of integration and very low power consumption. </p><p><H3>On-chip flash program memory</H3> The LPC1110/11/12/13/14 contain 32 kB (LPC1114), 24 kB (LPC1113), 16 kB (LPC1112), 8 kB (LPC1111),or 4 kB (LPC1110) of on-chip flash memory. <h3> On-chip SRAM</h3> The LPC1110/11/12/13/14 contain a total of 8 kB, 4 kB, 2 kB, or 1 kB on-chip static RAM memory. <p><author>MK - Datasheet available on www.nxp.com</author><p> <img src="http://www.nxp.com/img/NXP_logo.png"> The UHF EPCglobal Generation 2 standard allows the commercialized provision of mass adoption of UHF RFID technology for passive smart tags and labels. Main fields of applications are supply chain management and logistics for worldwide use with special consideration of European, US and Chinese frequencies to ensure that operating distances of several meters can be realized. The UCODE I2C is a product out of the NXP Semiconductors UCODE product family. The entire UCODE product family offers anti-collision and collision arbitration functionality. This allows a reader to simultaneously operate multiple labels/tags within its antenna field. A UCODE I2C based label/ tag requires no external power supply for contactless operation. Its contactless interface generates the power supply via the antenna circuit by propagative energy transmission from the interrogator (reader), while the system clock is generated by an on-chip oscillator. Data transmitted from the interrogator to the label/tag is demodulated by the interface, and it also modulates the interrogator's electromagnetic field for data transmission from the label/tag to the interrogator. A label/tag can be operated without the need for line of sight or battery, as long as it is connected to a dedicated antenna for the targeted frequency range. When the label/tag is within the interrogator's operating range, the high-speed wireless interface allows data transmission in both directions. The UCODE I2C also features an I2C interface to read/write data from its build in memory. In this mode the UCODE I2C needs to be supplied externally. The I2C interface supports standard and fast I2C modes. The used EEPROM is based on a field proven non-volatile memory technology. The EEPROM memory cell is also used in high quality automotive applications. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> NPN high-voltage transistor <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> PNP high-voltage transistor<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>45 V, 100 mA NPN general-purpose transistors</H2> NPN general-purpose transistor <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> PNP general purpose transistors<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> 30 V, 100 mA NPN general-purpose transistors <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> 65 V, 100 mA NPN general-purpose transistors <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> BC849; BC850 NPN general purpose transistors <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> 45 V, 100 mA NPN general-purpose transistors <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> PNP general purpose transistors <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> PNP general purpose transistors <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> PNP general purpose transistors <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> PNP general purpose transistors <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> Dual 65 V, 100 mA NPN/NPN general-purpose transistor <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> Dual 65 V, 100 mA NPN/NPN general-purpose transistor <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> Dual 65 V, 100 mA NPN/NPN general-purpose transistor <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> NPN/PNP general-purpose transistor pair in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> NPN/NPN general-purpose transistor pair in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> NPN/NPN general-purpose transistor pair in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> NPN/NPN general-purpose transistor pair in a small SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> PNP double transistor in an SC-88; SOT363 plastic package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> PNP double transistor in a SOT666 plastic package. NPN complement: BC847BV. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> PNP Resistor-Equipped Transistor (RET) family in small Surface-Mounted Device (SMD) plastic packages.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> PNP Resistor-Equipped Transistor (RET) family in small Surface-Mounted Device (SMD) plastic packages.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> NPN Resistor-Equipped Transistor (RET) family in small Surface-Mounted Device (SMD) plastic packages.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>PDTC114T</H2> NPN Resistor-Equipped Transistor (RET) family in small Surface-Mounted Device (SMD) plastic packages. <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> N-channel enhancement mode MOS transistor 20 V, dual N-channel Trench MOSFET <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2>General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> NXP darlington transistor Ic=500mA <b>CapFREE 150 mA, low-noise, low-drop regulator</b> with thermal protection 20 V, dual P-channel Trench MOSFET<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> 30 V, single N-channel Trench MOSFET<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> 15 V, 0.5 A NPN low VCEsat (BISS) transistor<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> Digital temperature sensor and thermal watchdog<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> 700 MHz to 3800 MHz high linearity variable gain amplifier <H2>Low voltage adjustable precision shunt regulators</H2> Low voltage three-terminal shunt regulator family with an output voltage range between Vref (1.24 V) and 18 V, to be set by two external resistors. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Dual power Schottky diode</H2>Dual common cathode power Schottky diode designed for high frequency switched mode power supplies in a SOT78 (TO-220AB) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>SPI Real time clock/calendar</H2> <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>N-channel logic level TrenchMOS(TM) transistor</H2> <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>60 V, single N-channel Trench MOSFET</H2>N-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> 30 V, single N-channel Trench MOSFET <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> 30 V, single P-channel Trench MOSFET <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> 20 V, single P-channel Trench MOSFET<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> 20 V, single N-channel Trench MOSFET<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> 20 V, single N-channel Trench MOSFET<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>50 V, 150 mA P-channel Trench MOSFET</H2> P-channel enhancement mode Field-Effect Transistor (FET) in a small Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> 30 V, single N-channel Trench MOSFET<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> GreenChip SMPS standby control IC Hyperfast power diode <H2>Industrial LCD driver for multiplex rates up to 1:8. I2C version.</H2> The PCF8537 is a fully featured Liquid Crystal Display (LCD) driver, specifically designed for high-contrast Vertical Alignment (VA) LCD with multiplex rates up to 1:8. It generates the drive signals for any static or multiplexed LCD containing up to eight backplanes, 46 segments, and up to 352 elements. The PCF8537 features an internal charge pump with internal capacitors for on-chip generation of the LCD driving voltage. To ensure an optimal and stable contrast over the full temperature range, the PCF8537 offers a programmable temperature compensation of the LCD supply voltage. The PCF8537 can be easily connected to a microcontroller by either the two-line I2C-bus (PCF8537AH) or a three-line bidirectional SPI-bus (PCF8537BH). <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Industrial LCD driver for multiplex rates up to 1:8. SPI version.</H2> The PCF8537 is a fully featured Liquid Crystal Display (LCD) driver, specifically designed for high-contrast Vertical Alignment (VA) LCD with multiplex rates up to 1:8. It generates the drive signals for any static or multiplexed LCD containing up to eight backplanes, 46 segments, and up to 352 elements. The PCF8537 features an internal charge pump with internal capacitors for on-chip generation of the LCD driving voltage. To ensure an optimal and stable contrast over the full temperature range, the PCF8537 offers a programmable temperature compensation of the LCD supply voltage. The PCF8537 can be easily connected to a microcontroller by either the two-line I2C-bus (PCF8537AH) or a three-line bidirectional SPI-bus (PCF8537BH). <p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> 3Q Hi-Com Triac 15 V, 0.5 A PNP low VCEsat (BISS) transistor High-speed USB 2.0 switch with enable Dual supply translating transceiver; open drain; auto direction sensing <H2>N-channel TrenchMOS logic level FET</H2> Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. <p>This product has been designed and qualified to the appropriate AEC standard for use in automotive critical applications.<p> <author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Bidirectional low capacitance ESD protection diode</H2> Low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD962 leadless ultra small Surface-Mounted Device (SMD) package designed to protect one signal line from the damage caused by ESD and other transients. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>20 V, 0.5 A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a Surface-Mounted Device (SMD) <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>AC Thyristor power switch</H2> AC Thyristor power switch in a SOT54 plastic package with self-protective capabilities against low and high energy transients<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diode</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diode</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diode</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diode</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2>General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2>General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2>General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2>General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2>General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2>General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diode</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diode</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diode</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diode</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diode</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diode</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2>General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2>General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2>General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2>General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General-purpose Schottky diodes</H2> General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General purpose controlled avalanche diode</H2> General purpose switching diodes fabricated in planar technology, and encapsulated in small rectangular plastic SMD SOT23 packages. The BAS29 consists of a single diode. The BAS31 has two diodes in series. The BAS35 has two diodes with a common anode. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General purpose controlled avalanche diode (double)</H2> General purpose switching diodes fabricated in planar technology, and encapsulated in small rectangular plastic SMD SOT23 packages. The BAS29 consists of a single diode. The BAS31 has two diodes in series. The BAS35 has two diodes with a common anode. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General purpose controlled avalanche diode (double)</H2> General purpose switching diodes fabricated in planar technology, and encapsulated in small rectangular plastic SMD SOT23 packages. The BAS29 consists of a single diode. The BAS31 has two diodes in series. The BAS35 has two diodes with a common anode. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General purpose diode</H2>The BAS19, BAS20 and BAS21 are general purpose diodes fabricated in planar technology, and encapsulated in a small SOT23 plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General purpose diode</H2>The BAS19, BAS20 and BAS21 are general purpose diodes fabricated in planar technology, and encapsulated in a small SOT23 plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General purpose diode</H2>The BAS19, BAS20 and BAS21 are general purpose diodes fabricated in planar technology, and encapsulated in a small SOT23 plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General purpose diode</H2>The BAS321 is a general purpose diode fabricated in planar technology and encapsulated in a plastic SOD323 package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low leakage switching diode</H2>Low leakage switching diode, encapsulated in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Single high-voltage switching diode</H2>Single high-voltage switching diode, fabricated in planar technology, and encapsulated in a SOD523 (SC-79) ultra small Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-speed double diode</H2>Two high-speed switching diodes fabricated in planar technology, and encapsulated in a small SOT143B Surface-Mounted Device (SMD) plastic package. The diodes are not connected.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low-voltage stabistor</H2>Low-voltage stabilization diode in a small SOT23 plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low-leakage diode</H2>Epitaxial medium-speed switching diode with a low leakage current, encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-voltage switching diodes</H2>Triple high-voltage switching diodes, encapsulated in a SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2>Planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted Device SMD package with tin-plated metal discs at each end. It is suitable for ?automatic placement? and as such it can withstand immersion soldering.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low-leakage diode</H2> Epitaxial medium-speed switching diode with a low leakage current in an ultra small SOD523 (SC-79) SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low-leakage diode</H2>Epitaxial, medium-speed switching diode with a low leakage current encapsulated in a small SOD323 SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-speed switching diode</H2> Single high-speed switching diode, fabricated in planar technology, and encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-speed double diode</H2> Two high-speed switching diodes fabricated in planar technology, and encapsulated in a small SOT143B Surface-Mounted Device (SMD) plastic package. The diodes are not connected.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Single high-speed switching diode</H2>Single high-speed switching diode, encapsulated in a SOD323F (SC-90) very small and ?at lead Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-voltage switching diodes</H2>Triple high-voltage switching diodes, encapsulated in a SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-speed switching diode</H2>High-speed switching diode, encapsulated in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-speed switching diodes</H2>High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-speed switching diode</H2>High-speed switching diode, encapsulated in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-speed switching diode</H2>High-speed switching diode, encapsulated in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Single low leakage current switching diode</H2>Single low leakage current switching diode, encapsulated in an ultra small SOT416 (SC-75) Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-voltage switching diode</H2>High-voltage switching diode, encapsulated in a SOT23 small Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-voltage switching diodes</H2>High-voltage switching diodes, encapsulated in a SOT23 small Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2>Planar Schottky barrier diode with an integrated guard ring against static discharges. This surface-mounted device is encapsulated in a small hermetically sealed SOD80C glass Surface-Mounted Device (SMD) package with tin-plated metal discs at each end. It is suitable for ?automatic placement? and as such it can withstand immersion soldering.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Band-switching diode</H2>Planar high performance band-switching diode in a small plastic SOD523 (SC-79) SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Band-switching diode</H2>The BA591 is a planar, high performance band-switching diode in the very small SOD323 (SC-76) SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Band-switching diode</H2>The BA891 is a planar high performance band-switching diode in the ultra small SOD523 SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Silicon planar diode</H2>Planar high performance band-switching diode in a small rectangular SOT23 SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Silicon PIN diode </H2> Planar PIN diode<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Silicon PIN diode </H2> Planar PIN diode<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General purpose PIN diode</H2>Two planar PIN diodes in common cathode configuration. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General purpose PIN diode</H2>Two planar PIN diodes in series configuration.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>General purpose PIN diode</H2>General purpose PIN diode<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2>Planar Schottky barrier diode encapsulated in a SOT323 very small plastic SMD package. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2>Planar Schottky barrier diode encapsulated in a SOT323 very small plastic SMD package. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2>Planar Schottky barrier diode encapsulated in a SOT323 very small plastic SMD package. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2>Planar Schottky barrier diode encapsulated in a SOT323 very small plastic SMD package. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2>Planar Schottky barrier diode encapsulated in a SOD323 very small plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diodes in small packages</H2>Planar Schottky barrier diodes with an integrated guard ring for stress protection. Encapsulated in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diodes in small packages</H2>Planar Schottky barrier diodes with an integrated guard ring for stress protection. Encapsulated in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diodes in small packages</H2>Planar Schottky barrier diodes with an integrated guard ring for stress protection. Encapsulated in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diodes in small packages</H2>Planar Schottky barrier diodes with an integrated guard ring for stress protection. Encapsulated in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diodes in small packages</H2>Planar Schottky barrier diodes with an integrated guard ring for stress protection. Encapsulated in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2>Planar Schottky barrier diode encapsulated in a SC-79 ultra small plastic SMD package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2>Planar Schottky barrier diode encapsulated in a SC-79 ultra small plastic SMD package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2>Planar Schottky barrier diode encapsulated in a SC-79 ultra small plastic SMD package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2>Planar Schottky barrier diode encapsulated in small plastic SMD packages. Single diodes and double diodes with different pinning are available<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2>Planar Schottky barrier diodes encapsulated in a SOT23 small plastic SMD package. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2>Planar Schottky barrier diodes encapsulated in a SOT23 small plastic SMD package. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2>Planar Schottky barrier diodes encapsulated in a SOT23 small plastic SMD package. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Two Schottky barrier double diodes</H2> Two planar Schottky barrier double diodes with common cathodes and an integrated guard ring for stress protection encapsulated in a SOT666 ultra small and flat lead Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier triple diode</H2>Planar Schottky barrier triple diode with an integrated guard ring for stress protection. Three electrically isolated Schottky barrier diodes, encapsulated in a SOT666 ultra small SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier quadruple diode in very small SOT363 package</H2> Schottky barrier quadruple diode with an integrated guard ring for stress protection. Two electrically isolated dual Schottky barrier diodes series, encapsulated in a SOT363 very small SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier double diode</H2>Planar Schottky barrier double diode with an integrated guard ring for stress protection. Two electrically isolated Schottky barrier diodes, encapsulated in a small SOT143B Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2>Planar Schottky barrier diodes encapsulated in a SOT23 small plastic SMD package. Low forward voltage selection of the BAT54 series. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2>Planar Schottky barrier diodes encapsulated in a SOT23 small plastic SMD package. Low forward voltage selection of the BAT54 series. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2>Planar Schottky barrier diodes encapsulated in a SOT23 small plastic SMD package. Low forward voltage selection of the BAT54 series. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2>Planar Schottky barrier diodes encapsulated in a SOT23 small plastic SMD package. Low forward voltage selection of the BAT54 series. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier triple diode</H2>Three internal (galvanic) isolated silicon epitaxial Schottky barrier diodes in a SOT363 small SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2> Planar Schottky barrier diode with an integrated protection ring against static discharges, encapsulated in a hermetically-sealed subminiature SOD68 (DO-34) package. The diode is suitable for mounting on a 2 E (5.08 mm) pitch.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2>Planar Schottky barrier diodes encapsulated in a SOT323 very small SMD plastic package. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2>Planar Schottky barrier diodes encapsulated in a SOT323 very small SMD plastic package. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2>Planar Schottky barrier diodes encapsulated in a SOT323 very small SMD plastic package. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2>Planar Schottky barrier diodes encapsulated in a SOT323 very small SMD plastic package. Single diodes and double diodes with different pinning are available.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2> Planar Schottky barrier diode with an integrated protection ring against static discharges, encapsulated in a hermetically-sealed subminiature SOD68 (DO-34) package. The diode is suitable for mounting on a 2 E (5.08 mm) pitch.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>100 mA low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD882 leadless ultra small Surface-Mounted Device (SMD) plastic package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>200 mA low Vf MEGA Schottky barrier rectifier</H2>Planar Maximum Ef?ciency General Application (MEGA) Schottky barrier recti?er with an integrated guard ring for stress protection, encapsulated in a SOD523 (SC-79) ultra small and ?at lead Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>100 mA low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD882 leadless ultra small Surface-Mounted Device (SMD) plastic package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>200 mA low Vf MEGA Schottky barrier rectifier</H2>Planar Maximum Ef?ciency General Application (MEGA) Schottky barrier recti?er with an integrated guard ring for stress protection, encapsulated in a SOD523 (SC-79) ultra small and ?at lead Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier single diode</H2>Planar Schottky barrier single diodes with an integrated guard ring for stress protection, encapsulated in small Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2> Planar Schottky barrier diode with an integrated guard ring for stress protection in a SOT323 (SC-70) small SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2>Planar Schottky barrier diode encapsulated in an SC-74 (SOT457) small plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier double diodes</H2>Planar Schottky barrier double diodes encapsulated in a SOT223 plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier double diodes</H2>Planar Schottky barrier double diodes encapsulated in a SOT223 plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier double diodes</H2>Planar Schottky barrier double diodes encapsulated in a SOT223 plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier double diodes</H2>Planar Schottky barrier double diodes encapsulated in a SOT223 plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier double diodes</H2>Planar Schottky barrier double diodes encapsulated in a SOT223 plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier double diodes</H2>Planar Schottky barrier double diodes encapsulated in a SOT223 plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Single Schottky barrier diode</H2>Single planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2>Planar Schottky barrier diode with an integrated guard ring for stress protection in a small SOT23 plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Medium power Schottky barrier single diode</H2>Planar medium power Schottky barrier single diode with an integrated guard ring for stress protection, encapsulated in a SOD323 (SC-76) very small Surface-Mounted Device SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2> Planar Schottky barrier diode with an integrated guard ring for stress protection in a SOT666 ultra small SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>40 V, 1 A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>40 V, 1.5 A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 (DFN1608D-2) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>40 V, 2 A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>10 V, 2 A ultra low VF MEGA Schottky barrier rectifiers</H2>Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small and flat lead plastic SMD packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>10 V, 3 A ultra low VF MEGA Schottky barrier rectifiers</H2>Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small and flat lead plastic SMD packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>40 V 0.5 A Very low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD323 (SC-76) very small SMD plastic packag<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>20V, 1A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a Surface-Mounted Device (SMD) <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>20V, 1.5A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a Surface-Mounted Device (SMD) <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>20V, 2A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a Surface-Mounted Device (SMD) <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>20V 2A low VF dual MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in a SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>30 V, 0.5 A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a Surface-Mounted Device (SMD) <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>30V 500 mA low VF dual MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>30 V, 1A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a Surface-Mounted Device (SMD) <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>20V, 1.5A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a Surface-Mounted Device (SMD) <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>30 V, 2A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a Surface-Mounted Device (SMD) <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>30V 2A low VF dual MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in a SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>30V, 3A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a Surface-Mounted Device (SMD) <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>30V, 5A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a Surface-Mounted Device (SMD) <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>40 V 0.2 A Very low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD323 (SC-76) very small SMD plastic packag<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>40 V, 0.5 A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 (DFN1608D-2) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>40 V, 1 A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 (DFN1608D-2) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>40 V, 3 A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>40 V, 5 A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>60V 0.2A very low VF MEGA Schottky barrier recti?ers</H2>Planar Maximum Ef?ciency General Application (MEGA) Schottky barrier recti?ers with an integrated guard ring for stress protection, encapsulated in ultra small and ?at lead Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>60V 0.2A very low VF MEGA Schottky barrier recti?ers</H2>Planar Maximum Ef?ciency General Application (MEGA) Schottky barrier recti?ers with an integrated guard ring for stress protection, encapsulated in ultra small and ?at lead Surface-Mounted Device (SMD) plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>60 V, 1 A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 (DFN1608D-2) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>60 V, 1 A low VF MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 (DFN1608D-2) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>60V 2A low VF dual MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in a SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>60V 3A low VF dual MEGA Schottky barrier rectifier</H2> Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in a SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Dual power Schottky diode</H2>Dual common cathode power Schottky diode designed for high frequency switched mode power supplies in a SOT78 (TO-220AB) plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2>An epitaxial Schottky barrier diode encapsulated in a SOD882 leadless ultra small plastic package. ESD sensitive device, observe handling precautions.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>15 V, 30 mA low Cd Schottky barrier diode</H2> Epitaxial low capacitance Schottky barrier diodes encapsulated in very small SMD plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>15 V, 30 mA low Cd Schottky barrier diode</H2> Epitaxial low capacitance Schottky barrier diodes encapsulated in very small SMD plastic packages.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2> Planar Schottky barrier diodes encapsulated in a SOT323 (SC-70) very small plastic SMD package. Single diodes and double diodes with different pinning are available. ESD sensitive device, observe handling precautions.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2> Planar Schottky barrier diodes encapsulated in a SOT323 (SC-70) very small plastic SMD package. Single diodes and double diodes with different pinning are available. ESD sensitive device, observe handling precautions.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2> Planar Schottky barrier diodes encapsulated in a SOT323 (SC-70) very small plastic SMD package. Single diodes and double diodes with different pinning are available. ESD sensitive device, observe handling precautions.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier (double) diodes</H2> Planar Schottky barrier diodes encapsulated in a SOT323 (SC-70) very small plastic SMD package. Single diodes and double diodes with different pinning are available. ESD sensitive device, observe handling precautions.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>4 V, 30 mA low Cd Schottky barrier diode</H2>Planar low capacitance Schottky barrier diode encapsulated in a very small SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>4 V, 30 mA low Cd Schottky barrier diode</H2>Planar low capacitance Schottky barrier diode encapsulated in a very small SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>4 V, 30 mA low Cd Schottky barrier diode</H2>Planar low capacitance Schottky barrier diode encapsulated in a very small SMD plastic package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier diode</H2>Planar Schottky barrier diode in a small SOT23 plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier double diode</H2> Planar Schottky barrier double diode in a SOT23 small plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Schottky barrier double diode</H2> Planar Schottky barrier double diode in a SOT23 small plastic SMD package.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>PNP general purpose transistors</H2> PNP transistor in a SOT23 plastic package. NPN complement: BCX19.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>VHF variable capacitance diode</H2>The BB131 is a variable capacitance diode, fabricated in planar technology, and encapsulated in the SOD323 (SC-76) very small plastic SMD package<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>UHF variable capacitance diode</H2>The BB135 is a variable capacitance diode, fabricated in planar technology, and encapsulated in the SOD323 very small plastic SMD package.The matched type, BB134 has the same specification.e<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>20 V dual P-channel Trench MOSFET</H2> Dual small-signal P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>N-channel TrenchMOS standard level FET</H2>Standard level N-channel MOSFET in a SOT404 package using TrenchMOS technology. This product has been designed and qualified to AEC Q101 standard for use in high performance automotive applications.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low Cost Narrow Band Communication Controller</H2> The ASIC DLC-3 is a low cost narrow band communication controller MCM (Multi Carrier Modulation) and power line chip. The integrated ARMÒ CortexTM CPU, memory and common interfaces makes it possible to build different systems with a minimum of external components. For communication with DLC-3 the most popular interfaces like Ethernet MII, SPI, several freely configurable serial interfaces and general IO ports for CPU and DSC are included. The ASIC includes all components for a power-line communication while Analog Front End and Power Amplifier are already integrated. With its On-Chip Power-Factor-Correction, Ballast Control and 4 PWM outputs the LCI is a optimal solution for lighting control units. The freely configurable serial interfaces makes it easy to build electronic power meters for smart-metering applications.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low-power buffer with open-drain output</H2> The 74AUP1G07 provides the single non-inverting buffer with open-drain output. The output of the device is an open drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions. Schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low-power 2-input EXCLUSIVE-OR gate</H2> The 74AUP1G86 provides the single 2-input EXCLUSIVE-OR function. Schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low-power 2-input OR-gate</H2> The 74AUP1G32 provides the single 2-input OR function. Schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-speed switching diode</H2> High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-speed switching diode</H2> High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Single Schmitt-trigger inverter</H2> The 74LVC1G14 provides the inverting buffer function with Schmitt-trigger input. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. Schmitt-trigger action at the input makes the circuit tolerant for slower input rise and fall time. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Quad buffer/line driver with 5 V tolerant input/outputs; 3-state</H2>The 74LVC125A consists of four non-inverting buffers/line drivers with 3-state outputs (nY) that are controlled by the output enable input (nOE). A HIGH at nOE causes the outputs to assume a high-impedance OFF-state. Inputs can be driven from either 3.3 V or 5 V devices. When disabled, up to 5.5 V can be applied to the outputs.<p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>1 GHz wideband low-noise amplifier with bypass</H2> The BGU7045 MMIC is a 3.3 V wideband amplifier with bypass mode. It is designed specifically for high linearity, low-noise applications over a frequency range of 40 MHz to 1 GHz. It is especially suited for Set-Top Box applications. The LNA is housed in a 6-pin SOT363 plastic SMD package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>1 GHz wideband low-noise amplifier with bypass</H2> The BGU7032 MMIC is a wideband amplifier with bypass mode. It is designed specifically for high linearity, low-noise applications over a frequency range of 40 MHz to 1 GHz. It is especially suited to Set-Top Box applications. The LNA is housed in a 6-pin SOT363 plastic SMD package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Threshold detector and reset generator</H2> The PCF1252-Xs are low-power CMOS voltage threshold detectors designed especially for supervision of microcontroller/microprocessor systems for detection of power-on/off conditions and generation of a system reset pulse. The PCF1252-X also provides a POWF (power fail) output which is activated at a precise factory-programmed trip point. A system RESET output has a built-in delay with duration determined by an external capacitor (CCT). A second comparator (comparator 2) has been included to enable the possibility of a second monitoring point in the system. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Bus buffer/line driver; 3-state</H2> The 74LVC1G125 provides one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input (OE). A HIGH-level at pin OE causes the output to assume a high-impedance OFF-state. The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Dual bus buffer/line driver; 3-state</H2> The 74LVC2G125 provides a dual non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input (pin nOE). A HIGH-level at pin nOE causes the output to assume a high-impedance OFF-state. Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and fall times. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Femtofarad unidirectional fivefold ESD protection array</H2> Femtofarad capacitance unidirectional ElectroStatic Discharge (ESD) protection diode array designed to protect up to five signal lines from the damage caused by ESD and other transients. The device is encapsulated in a leadless ultra small DFN1410-6 (SOT886) Surface-Mounted Device (SMD) plastic package. The combination of extremely low capacitance, high ESD maximum rating and ultra small package makes the device ideal for high-speed data line protection and antenna protection applications. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo and Compass</H2> The BGU8007 is a Low Noise Amplifier (LNA) for GNSS receiver applications in a plastic leadless 6-pin, extremely small SOT886 package. The BGU8007 requires only one external matching inductor and one external decoupling capacitor. The BGU8007 adapts itself to the changing environment resulting from co-habitation of different radio systems in modern cellular handsets. It has been designed for low power consumption and optimal performance when jamming signals from co-existing cellular transmitters are present. At low jamming power levels it delivers 19 dB gain at a noise figure of 0.75 dB. During high jamming power levels, resulting for example from a cellular transmit burst, it temporarily increases its bias current to improve sensitivity <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>STARplug switched mode power supply controller IC</H2> The TEA1623 is a Switched Mode Power Supply (SMPS) controller IC that operates directly from rectified universal mains. It is implemented in the high voltage EZ-HV SOI process, combined with a low voltage BiCMOS process. The device includes a high voltage power switch and a circuit for start-up directly from the rectified mains voltage. A dedicated circuit for valley switching is built in, which makes a very efficient slim-line electronic power-plug concept possible. In its most basic version of application, the TEA1623 acts as a voltage source. Here, no additional secondary electronics are required. A combined voltage and current source can be realized with minimum costs for external components. Implementation of the TEA1623 renders an efficient and low cost power supply system. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>GreenChip SMPS control IC</H2> The TEA1731LTS is a low cost Switched Mode Power Supply (SMPS) controller IC intended for flyback topologies. The TEA1731LTS operates in peak current and frequency control mode. Frequency jitter has been implemented to reduce ElectroMagnetic Interference (EMI). Slope compensation is integrated for Continuous Conduction Mode (CCM) operation. The TEA1731LTS IC features OverPower Protection (OPP). The controller accepts an overpower situation for a limited amount of time. One pin is reserved for protection purposes. OverTemperature Protection (OTP) can be implemented with a minimal number of external components. At low-power levels, the primary peak current is set to 25 % of the maximum peak current. The switching frequency is reduced to limit the switching losses. The combination of fixed frequency operation at high output power and frequency reduction at low output power provides high efficiency over the total load range. The TEA1731LTS makes the design of low cost, highly efficient and reliable supplies for power requirements up to 75 W easier by requiring a minimum number of external components. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-voltage switching diodes</H2> High-voltage switching diodes, encapsulated in a very small Surface-Mounted Device (SMD) plastic package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>High-voltage switching diodes</H2> High-voltage switching diodes, encapsulated in a very small Surface-Mounted Device (SMD) plastic package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>400 V, 1 A high power density, standard switching time PN-rectifier</H2> High power density, standard switching time PN-rectifier with high-efficiency planar technology, encapsulated in a small and flat lead SOD123W Surface-Mounted Device (SMD) plastic package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low-power Schmitt trigger</H2> The 74AUP1G17 provides the single Schmitt trigger buffer. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial Power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. The inputs switch at different points for positive and negative-going signals. The difference between the positive voltage VT+ and the negative voltage VT is defined as the input hysteresis voltage VH. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Ultra-configurable multiple function gate; 3-state</H2> The 74LVC1G99 provides a low voltage, ultra-configurable, multiple function gate with 3-state output. The device can be configured as one of several logic functions including, AND, OR, NAND, NOR, XOR, XNOR, inverter, buffer and MUX. No external components are required to configure the device as all inputs can be connected directly to VCC or GND. The 3-state output is controlled by the output enable input (OE). A HIGH level at OE causes the output (Y) to assume a high-impedance OFF-state. When OE is LOW, the output state is determined by the signals applied to the Schmitt trigger inputs (A, B, C and D). Due to the use of Schmitt trigger inputs the device is tolerant of slowly changing input signals, transforming them into sharply defined, jitter free output signals. By eliminating leakage current paths to VCC and GND, the inputs and disabled output are also over-voltage tolerant, making the device suitable for mixed-voltage applications. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. The 74LVC1G99 is fully specified over the supply range from 1.65 V to 5.5 V. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low dropout regulator, high PSRR, 150 mA</H2> The LD6815 series is a small-size Low DropOut regulator (LDO) family with ultra high Power Supply Rejection Ratio (PSRR) of 75 dB. The voltage drop is 250 mV at 150 mA current rating. Operating voltages can range from 2.3 V to 5.5 V. The devices are available with fixed output voltages between 1.2 V and 3.6 V. The LD6815TD/xxH devices show a high-ohmic state at the output pin when set to disabled mode. The LD6815TD/xxP devices contain a pull-down switching transistor to provide a low-ohmic output state (auto discharge function) in disabled mode. The LD6815 series devices are available in SOT753 (TSOP5) plastic package. All devices are manufactured in monolithic silicon technology. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Short</H2> Description <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USB device; USART</H2> The LPC11U3x are a ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11U3x operate at CPU frequencies of up to 50 MHz. Equipped with a highly flexible and configurable Full Speed USB 2.0 device controller, the LPC11U3x brings unparalleled design flexibility and seamless integration to today’s demanding connectivity solutions. The peripheral complement of the LPC11U3x includes up to 128 kB of flash memory, up to 12 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I 2 C-bus interface, one RS-485/EIA-485 USART with support for synchronous mode and smart card interface, two SSP interfaces, four general purpose counter/timers, a 10-bit ADC, and up to 54 general purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USB device; USART</H2> The LPC11U3x are a ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11U3x operate at CPU frequencies of up to 50 MHz. Equipped with a highly flexible and configurable Full Speed USB 2.0 device controller, the LPC11U3x brings unparalleled design flexibility and seamless integration to today’s demanding connectivity solutions. The peripheral complement of the LPC11U3x includes up to 128 kB of flash memory, up to 12 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I 2 C-bus interface, one RS-485/EIA-485 USART with support for synchronous mode and smart card interface, two SSP interfaces, four general purpose counter/timers, a 10-bit ADC, and up to 54 general purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USB device; USART</H2> The LPC11U3x are a ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11U3x operate at CPU frequencies of up to 50 MHz. Equipped with a highly flexible and configurable Full Speed USB 2.0 device controller, the LPC11U3x brings unparalleled design flexibility and seamless integration to today’s demanding connectivity solutions. The peripheral complement of the LPC11U3x includes up to 128 kB of flash memory, up to 12 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I 2 C-bus interface, one RS-485/EIA-485 USART with support for synchronous mode and smart card interface, two SSP interfaces, four general purpose counter/timers, a 10-bit ADC, and up to 54 general purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USB device; USART</H2> The LPC11U3x are a ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11U3x operate at CPU frequencies of up to 50 MHz. Equipped with a highly flexible and configurable Full Speed USB 2.0 device controller, the LPC11U3x brings unparalleled design flexibility and seamless integration to today’s demanding connectivity solutions. The peripheral complement of the LPC11U3x includes up to 128 kB of flash memory, up to 12 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I 2 C-bus interface, one RS-485/EIA-485 USART with support for synchronous mode and smart card interface, two SSP interfaces, four general purpose counter/timers, a 10-bit ADC, and up to 54 general purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USB device; USART</H2> The LPC11U3x are a ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11U3x operate at CPU frequencies of up to 50 MHz. Equipped with a highly flexible and configurable Full Speed USB 2.0 device controller, the LPC11U3x brings unparalleled design flexibility and seamless integration to today’s demanding connectivity solutions. The peripheral complement of the LPC11U3x includes up to 128 kB of flash memory, up to 12 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I 2 C-bus interface, one RS-485/EIA-485 USART with support for synchronous mode and smart card interface, two SSP interfaces, four general purpose counter/timers, a 10-bit ADC, and up to 54 general purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USB device; USART</H2> The LPC11U3x are a ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11U3x operate at CPU frequencies of up to 50 MHz. Equipped with a highly flexible and configurable Full Speed USB 2.0 device controller, the LPC11U3x brings unparalleled design flexibility and seamless integration to today’s demanding connectivity solutions. The peripheral complement of the LPC11U3x includes up to 128 kB of flash memory, up to 12 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I 2 C-bus interface, one RS-485/EIA-485 USART with support for synchronous mode and smart card interface, two SSP interfaces, four general purpose counter/timers, a 10-bit ADC, and up to 54 general purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USB device; USART</H2> The LPC11U3x are a ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11U3x operate at CPU frequencies of up to 50 MHz. Equipped with a highly flexible and configurable Full Speed USB 2.0 device controller, the LPC11U3x brings unparalleled design flexibility and seamless integration to today’s demanding connectivity solutions. The peripheral complement of the LPC11U3x includes up to 128 kB of flash memory, up to 12 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I 2 C-bus interface, one RS-485/EIA-485 USART with support for synchronous mode and smart card interface, two SSP interfaces, four general purpose counter/timers, a 10-bit ADC, and up to 54 general purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USB device; USART</H2> The LPC11U3x are a ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11U3x operate at CPU frequencies of up to 50 MHz. Equipped with a highly flexible and configurable Full Speed USB 2.0 device controller, the LPC11U3x brings unparalleled design flexibility and seamless integration to today’s demanding connectivity solutions. The peripheral complement of the LPC11U3x includes up to 128 kB of flash memory, up to 12 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I 2 C-bus interface, one RS-485/EIA-485 USART with support for synchronous mode and smart card interface, two SSP interfaces, four general purpose counter/timers, a 10-bit ADC, and up to 54 general purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USB device; USART</H2> The LPC11U3x are a ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11U3x operate at CPU frequencies of up to 50 MHz. Equipped with a highly flexible and configurable Full Speed USB 2.0 device controller, the LPC11U3x brings unparalleled design flexibility and seamless integration to today’s demanding connectivity solutions. The peripheral complement of the LPC11U3x includes up to 128 kB of flash memory, up to 12 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I 2 C-bus interface, one RS-485/EIA-485 USART with support for synchronous mode and smart card interface, two SSP interfaces, four general purpose counter/timers, a 10-bit ADC, and up to 54 general purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USB device; USART</H2> The LPC11U3x are a ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11U3x operate at CPU frequencies of up to 50 MHz. Equipped with a highly flexible and configurable Full Speed USB 2.0 device controller, the LPC11U3x brings unparalleled design flexibility and seamless integration to today’s demanding connectivity solutions. The peripheral complement of the LPC11U3x includes up to 128 kB of flash memory, up to 12 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I 2 C-bus interface, one RS-485/EIA-485 USART with support for synchronous mode and smart card interface, two SSP interfaces, four general purpose counter/timers, a 10-bit ADC, and up to 54 general purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash; up to 12 kB SRAM and 4 kB EEPROM; USB device; USART</H2> The LPC11U3x are a ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11U3x operate at CPU frequencies of up to 50 MHz. Equipped with a highly flexible and configurable Full Speed USB 2.0 device controller, the LPC11U3x brings unparalleled design flexibility and seamless integration to today’s demanding connectivity solutions. The peripheral complement of the LPC11U3x includes up to 128 kB of flash memory, up to 12 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I 2 C-bus interface, one RS-485/EIA-485 USART with support for synchronous mode and smart card interface, two SSP interfaces, four general purpose counter/timers, a 10-bit ADC, and up to 54 general purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Top Triac</H2> Planar passivated Temperature and Overload Protected Triac with high commutation performance in a SOT78 (TO-220AB) plastic package. This TOPTriac TM conveniently self protects by turning off in the event of excessive temperature. It is triggered negatively, which can be continuous DC or pulsed. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>N-channel TrenchMOS FET</H2> N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>N-channel TrenchMOS FET</H2> N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>60 V, 0.3 A N-channel Trench MOSFET</H2> ESD protected N-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>60 V, 320 mA N-channel Trench MOSFET</H2> Dual N-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>60 V, 340 mA dual N-channel Trench MOSFET</H2> Dual N-channel enhancement mode Field-Effect Transistor (FET) in an ultra small SOT666 Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>P-channel enhancement mode vertical DMOS transistor</H2> P-channel enhancement mode vertical Diffusion Metal-Oxide Semiconductor (DMOS) transistor in a small Surface-Mounted Device (SMD) plastic package. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>ESD protection for ultra high-speed interfaces</H2> The device is designed to protect high-speed interfaces such as SuperSpeed USB, High-Definition Multimedia Interface (HDMI), DisplayPort, external Serial Advanced Technology Attachment (eSATA) and Low Voltage Differential Signaling (LVDS) interfaces against ElectroStatic Discharge (ESD). The device includes four high-level ESD protection diode structures for ultra high-speed signal lines and is encapsulated in leadless ultra small DFN2510A-10 (SOT1176-1) plastic package. All signal lines are protected by a special diode configuration offering ultra low line capacitance of only 0.5 pF. These diodes utilize a unique snap-back structure in order to provide protection to downstream components from ESD voltages up to 10 kV contact exceeding IEC 61000-4-2, level 4. In order to reduce the capacitance variation versus channel DC voltage, the ground diodes between each channel and ground pins 3 and 8 are implemented as Shockley diodes. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>Low-voltage translating, 8-bit I2C-bus/SMBus I/O expander with interrupt output, reset, and configuration registers</H2> The PCAL6408A is an 8-bit general purpose I/O expander that provides remote I/O expansion for most microcontroller families via the I2C-bus interface. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0+ microcontroller</H2> The LPC81xM are an ARM Cortex-M0+ based, low-cost 32-bit MCU family operating at CPU frequencies of up to 30 MHz. The LPC81xM support up to 16 kB of flash memory and 4 kB of SRAM. The peripheral complement of the LPC81xM includes a CRC engine, one I 2 C-bus interface, up to three USARTs, up to two SPI interfaces, one multi-rate timer, self wake-up timer, and state-configurable timer, one comparator, function-configurable I/O ports through a switch matrix, an input pattern match engine, and up to 18 general-purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0+ microcontroller</H2> The LPC81xM are an ARM Cortex-M0+ based, low-cost 32-bit MCU family operating at CPU frequencies of up to 30 MHz. The LPC81xM support up to 16 kB of flash memory and 4 kB of SRAM. The peripheral complement of the LPC81xM includes a CRC engine, one I 2 C-bus interface, up to three USARTs, up to two SPI interfaces, one multi-rate timer, self wake-up timer, and state-configurable timer, one comparator, function-configurable I/O ports through a switch matrix, an input pattern match engine, and up to 18 general-purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0+ microcontroller</H2> The LPC81xM are an ARM Cortex-M0+ based, low-cost 32-bit MCU family operating at CPU frequencies of up to 30 MHz. The LPC81xM support up to 16 kB of flash memory and 4 kB of SRAM. The peripheral complement of the LPC81xM includes a CRC engine, one I 2 C-bus interface, up to three USARTs, up to two SPI interfaces, one multi-rate timer, self wake-up timer, and state-configurable timer, one comparator, function-configurable I/O ports through a switch matrix, an input pattern match engine, and up to 18 general-purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png"> <H2>32-bit ARM Cortex-M0+ microcontroller</H2> The LPC81xM are an ARM Cortex-M0+ based, low-cost 32-bit MCU family operating at CPU frequencies of up to 30 MHz. The LPC81xM support up to 16 kB of flash memory and 4 kB of SRAM. The peripheral complement of the LPC81xM includes a CRC engine, one I 2 C-bus interface, up to three USARTs, up to two SPI interfaces, one multi-rate timer, self wake-up timer, and state-configurable timer, one comparator, function-configurable I/O ports through a switch matrix, an input pattern match engine, and up to 18 general-purpose I/O pins. <p><author>AAL Eindhoven MK</author><hr><p> <img src="http://www.nxp.com/img/NXP_logo.png">